| Ogo ogo | • Standard IPC 2-3 |
| Mgbakọ teknụzụ | • SMD Stensụl • PCB mmepụta • Mgbakọ SMT PCB • THTmgbakọ • Cable na Wire Harness Assembly • NkwekọrịtaMkpuchi • Mgbakọ interface onye ọrụ • Ewu IgbeMgbakọ • Ikpeazụmgbakọ ngwaahịa |
| Ọrụ agbakwunyere uru | • Isi mmalite • Mbukota na nnyefe • DFM • mbukota nannyefe • PCBA sample • rụgharịa ọrụ • Mmemme IC • Akụkọ NPI |
| Asambodo ụlọ ọrụ | • ISO9001 • IATF16949 • ISO13485 • 14001 |
| Asambodo ngwaahịa | • UL • RoHS • SGS • iru |
| Ịtụ ikike | • Ọnweghị ihe achọrọ nke MOQ (ọnụahịa kacha nta) |
| Usoro nnwale | Nyocha akwụkwọ ntuziaka QC SPI(Nyochaa Tapawa Solder)X-ray • FAI ( edemede mbụ nyocha) ICT FCT ule ịka nká ule ntụkwasị obi |
| Ọdụ ụgbọ mmiri FOB | Shenzhen |
| Ibu kwa nkeji | 150.0 grams |
| Koodu HTS | 3824.99.70 00 |
| Mbupu Katọn Akụkụ L/W/H | 53.0 x 29.0 x 37.0 centimita |
| Etiti oge | 14-21 ụbọchị |
| Akụkụ kwa nkeji | 15.0 x 10.0 x 3.0 centimita |
| Nkeji kwa Katọn Mbupụ | 100.0 |
| Mbupu katọn arọ | 13.0 kilogram |