N'ígwé | 1-2 n'ígwé |
Ọkpụrụkpụ Emechara | 16-134mil (0.4mm-3.4mm) |
Oke. Akụkụ | 500mm * 1200mm |
Ọkpụkpụ ọla kọpa | 35um, 70um,1 ruo 10oZ |
Ogologo Ahịrị Obere/Oghere | 4mil (0.1mm) |
Nha oghere Min emechara | 0.95mm |
Min. Nha egwu egwu | 1.00mm |
Oke. Nha egwu egwu | 6.5mm |
Nleta nha nha oghere agwụla | ± 0.050mm |
Ọnọdụ oghere nkenke | ± 0.076mm |
Nha SMT PAD | 0.4mm ± 0.1mm |
Min. Solder mkpuchi PAD | 0.05mm(2mil) |
Ihe mkpuchi mkpuchi Min. Solder | 0.05mm(2mil) |
Ihe mkpuchi solder | >12um |
Mmecha elu | HAL, HAL N'efu, OSP, ọla edo imi, wdg |
Ọkpụrụkpụ HAL | 5-12 um |
Ọkpụrụkpụ ọla edo imikpu | 1-3 nde |
Ihe nkiri OSP | ENTEK PLUS HT: 0.3-0.5um; F2: 0.15-0.3um |
Mmecha ndepụta | Ntugharị & Punching; Ngbanwe nkenke ± 0.10mm |
Nrụpụta okpomọkụ | 1.0 ruo 12w/mk |
Ọdụ ụgbọ mmiri FOB | Shenzhen |
Mbupu Katọn Akụkụ L/W/H | 36 x 26 x 25 centimita |
Etiti oge | 3-7 ụbọchị |
Nkeji kwa Katọn Mbupụ | 5.0 |
Mbupu katọn arọ | 18 Kilogram |